Amazon cover image
Image from Amazon.com

Micro and Nano Fabrication [electronic resource] : Tools and Processes / by Hans H. Gatzen, Volker Saile, Jürg Leuthold.

By: Contributor(s): Material type: TextTextPublisher: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2015Description: XXVI, 519 p. 357 illus., 54 illus. in color. online resourceContent type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9783662443958
Subject(s): Additional physical formats: Printed edition:: No titleDDC classification:
  • 620.5 23
Online resources:
Contents:
Introduction-MEMS, a Historical Perspective -- Vacuum Technology -- Deposition Technologies -- Etching Technologies -- Doping and Surface Modification -- Lithography -- LIGA -- Nanofabrication by Self-Assembly -- Enabling Technologies I - Wafer Planarization and Bonding -- Enabling Technologies II - Contamination Control -- Device Fabrication - An Example.
In: Springer eBooksSummary: For Microelectromechanical Systems (MEMS) and Nanoelectromechanical Systems (NEMS) production, each product requires a unique process technology. This book provides a comprehensive insight into the tools necessary for fabricating MEMS/NEMS and the process technologies applied. Besides, it describes enabling technologies which are necessary for a successful production, i.e., wafer planarization and bonding, as well as contamination control.
No physical items for this record

Introduction-MEMS, a Historical Perspective -- Vacuum Technology -- Deposition Technologies -- Etching Technologies -- Doping and Surface Modification -- Lithography -- LIGA -- Nanofabrication by Self-Assembly -- Enabling Technologies I - Wafer Planarization and Bonding -- Enabling Technologies II - Contamination Control -- Device Fabrication - An Example.

For Microelectromechanical Systems (MEMS) and Nanoelectromechanical Systems (NEMS) production, each product requires a unique process technology. This book provides a comprehensive insight into the tools necessary for fabricating MEMS/NEMS and the process technologies applied. Besides, it describes enabling technologies which are necessary for a successful production, i.e., wafer planarization and bonding, as well as contamination control.